Micron, Government Reach Deal For 4.6 Billion In Grants For Clay Project

Washington, D.C. - The Federal Government and Micron Technology have agreed to a final deal that will provide the chipmaker with $6.1 billion in grants to build help Micron build their plants in New York and Idaho.

The agreement reached after eight months of negotiations, locks in incentives that Micron wanted to start building its planned $100 billion complex on 1400 acres at White Pine Commerce Park, just off Route 31 in Clay.

The final agreement makes Micron eligible for up to $4.6 billion in grants for Clay and $1.5 billion in grants for their Boise expansion.

In a press releases Onondaga County Executive Ryan McMahon said, “Today’s announcement is further proof of the undeniable momentum and progress taking place in our community and across Central New York. With this agreement, the Micron project has taken a huge and significant step forward while also solidifying Onondaga County as the hub for memory technology semiconductor manufacturing in the world!”

Micron hopes to break ground on the Clay facility in the fall of 2025.

Photo: WSYR, NEWS


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